{"id":2095,"date":"2025-02-28T15:08:08","date_gmt":"2025-02-28T06:08:08","guid":{"rendered":"https:\/\/amti.co.jp\/app\/?p=2095"},"modified":"2025-07-25T17:16:21","modified_gmt":"2025-07-25T08:16:21","slug":"amt-pattern-wafers","status":"publish","type":"post","link":"https:\/\/amti.co.jp\/en\/amt-pattern-wafers\/","title":{"rendered":"AMT Pattern Wafers"},"content":{"rendered":"\n<h4 class=\"wp-block-heading\">We offer a wide selection of patterned wafers essential for semiconductor process research and evaluation.<\/h4>\n\n\n\n<h4 class=\"wp-block-heading\">Manufactured under strict process control, our wafers ensure high quality and outstanding stability. From standard mask patterns to custom designs tailored for specific applications, we provide a diverse range of options to meet various research and development needs.<\/h4>\n\n\n\n<h4 class=\"wp-block-heading\">In addition to our standard lineup, we also accommodate custom specifications. Feel free to <a href=\"https:\/\/amti.co.jp\/en\/contact\/\">contact us<\/a> to discuss your requirements!<\/h4>\n\n\n\n<h5 class=\"wp-block-heading\">\u25cfMIT 854\/754 Pattern wafer<\/h5>\n\n\n\n<p><strong>Cu CMP(TEOS Etch\/Cu Fill), W CMP(TEOS Etch\/W Fill), STI Pattern(Poly-Si, HDP, SiN Fill etc.)<\/strong><\/p>\n\n\n\n<h5 class=\"wp-block-heading\">\u25cfMIT 864\/764 Pattern wafer, AMT-STI, AMT-S3 Pattern wafer<\/h5>\n\n\n\n<p><strong>STI, ILD Pattern(HDP, TEOS, SiN, Poly-Si Fill etc.)<\/strong><\/p>\n\n\n\n<h5 class=\"wp-block-heading\">\u25cfAMT 3D-ILD Pattern wafer<\/h5>\n\n\n\n<p><strong>3D-ILD CMP Pattern wafer<\/strong> <strong>(1mm~ large features, 2um,3um Depth etc.)<\/strong><\/p>\n\n\n\n<h5 class=\"wp-block-heading\">\u25cfAMT Cu Hybrid Bonding CMP Pattern Wafer(min. 0.25um Hole)<\/h5>\n\n\n\n<p><strong>Cu CMP(TEOS Etch\/Cu Fill), W CMP(TEOS Etch\/W Fill)<\/strong><\/p>\n\n\n\n<h5 class=\"wp-block-heading\">\u25cfAMT TSV Pattern<\/h5>\n\n\n\n<p><strong>\u03c65um*50um Depth, \u03c610um*100um Depth etc.<\/strong><\/p>\n\n\n\n<h5 class=\"wp-block-heading\">\u25cfFine Trench Pattern, Resist pattern, Bump, RDL wafer for Packaging development etc.<\/h5>\n\n\n\n<p><strong>Fine Trench Pattern(min. 20nm L\/S), RDL Pattern(L\/S=5um), \u03c65um \u03bc-Bump, \u03c625um Cu Pillar Bump etc.<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-gallery has-nested-images columns-2 is-cropped wp-block-gallery-1 is-layout-flex wp-block-gallery-is-layout-flex\"><\/figure>\n\n\n\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"We offer a wide selection of patterned wafers essential for semiconductor process research and evaluation. Man [&hellip;]","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_locale":"en_US","_original_post":"https:\/\/amti.co.jp\/app\/?p=1923","footnotes":""},"categories":[4],"tags":[],"productcat":[24],"pickup":[18],"class_list":["post-2095","post","type-post","status-publish","format-standard","hentry","category-product-list","productcat-pattern-wafers","pickup-prpickup","en-US"],"acf":[],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.9 - aioseo.com -->\n\t<meta name=\"robots\" content=\"max-image-preview:large\" \/>\n\t<meta name=\"author\" content=\"mw2p3wlfu5\"\/>\n\t<link rel=\"canonical\" href=\"https:\/\/amti.co.jp\/en\/amt-pattern-wafers\/\" \/>\n\t<meta name=\"generator\" content=\"All in One SEO (AIOSEO) 4.9.9\" \/>\n\t\t<script type=\"application\/ld+json\" class=\"aioseo-schema\">\n\t\t\t{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/amti.co.jp\\\/en\\\/amt-pattern-wafers\\\/#article\",\"name\":\"AMT Pattern Wafers | AMT - 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