![半導体テストウェハの専門商社 | [AMT]アドバンスマテリアルテクノロジー株式会社](/common/images/site-id-en.gif)
AMT provides test wafers that include cutting-edge technology
for research and development of CMP, deposition, etching, and TSV.
We change the type and thickness of the film of wafers on demand.
▶List
- 2015/12.03
- ☆We are participating in 17th Packaging TECHNOLOGY EXPO !
- 2015/8.19
- ☆We are participating in “Semicon Taiwan 2015” !【TWTC Nangang Hall】9/2-4
- 2014/11.21
- ★We are participating in 16th Packaging TECHNOLOGY EXPO !(Jan14-16 Tokyo, Japan)
- 2014/8.27
- ☆We are participating in “Semicon Taiwan 2014” !【TWTC Nangang Exhibition Hall 9/3-5】
- 2014/8.22
- Notice regarding Conclusion of Acquisition Contract of ＴＥＧ Service business 2014/8/6
- 2014/1.08
- ★We are participating in 15th Packaging TECHNOLOGY EXPO !(Jan15-17 Tokyo, Japan)
- 2013/7.29
- Our Taiwan Office newly opened.
- 2013/7.29
- BD-ULK Cu pattern
- 2013/3.15
- Resist Patterning on Quartz or SiC substrate
- 2012/9.06
- High Aspect Ratio Trench Pattern 200mm Si Wafer
